The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Feb. 24, 2015
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Russ Alan Reisner, Newbury Park, CA (US);

Joel Richard King, Newbury Park, CA (US);

Ziv Alon, Thousand Oaks, CA (US);

Tin Wai Kwan, Thousand Oaks, CA (US);

Aleksey A. Lyalin, Thousand Oaks, CA (US);

Xiaodong Xu, Oak Park, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/44 (2006.01); H04B 1/40 (2015.01); H01L 25/00 (2006.01); H03F 1/56 (2006.01); H03F 3/19 (2006.01); H03F 3/21 (2006.01); H04B 1/04 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01); H01L 25/50 (2013.01); H03F 1/56 (2013.01); H03F 3/19 (2013.01); H03F 3/211 (2013.01); H04B 1/0458 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H03F 2200/111 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21106 (2013.01); H03F 2203/21139 (2013.01); H03F 2203/21142 (2013.01); H04B 2001/0408 (2013.01);
Abstract

Systems, devices and methods related to improved radio-frequency (RF) modules. In some embodiments, an RF module can include a packaging substrate, a power amplifier (PA) assembly implemented on a first die mounted on the packaging substrate, and a controller circuit implemented on a second die mounted on the first die. The controller circuit can be configured to provide at least some control of the PA assembly. The RF module can further include one or more output matching network (OMN) devices mounted on the packaging substrate and configured to provide output matching functionality for the PA assembly. The RF module can further include a band selection switch device mounted on each OMN device.


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