The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Aug. 29, 2014
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Alan Weir Bucher, Manheim, PA (US);

Richard Dean Miller, Lancaster, PA (US);

Assignee:

Tyco Electronics Corporation, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); H01R 13/66 (2006.01); H05K 7/20 (2006.01); H01R 12/70 (2011.01); H01R 12/72 (2011.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6691 (2013.01); G02B 6/4274 (2013.01); H01R 12/7076 (2013.01); H01R 12/722 (2013.01); H05K 7/20436 (2013.01);
Abstract

Pluggable connector including a connector housing having a leading end configured to mate with a receptacle assembly. The connector housing has an interior cavity. The pluggable connector also includes a communication assembly held by the connector housing. The communication assembly includes internal electronics located within the interior cavity, and a mating terminal located proximate to the leading end. The mating terminal is communicatively coupled to the internal electronics. The pluggable connector also includes a thermal-transfer assembly that is disposed within the interior cavity. The thermal-transfer assembly includes first and second thermal-transfer modules that each include a plurality of spaced-apart projections. The corresponding projections of the first and second thermal-transfer modules are interleaved with one another. The first thermal-transfer module is coupled to the internal electronics, and the second thermal-transfer module is coupled to the connector housing.


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