The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Jul. 02, 2014
Applicant:

Nthdegree Technologies Worldwide Inc., Tempe, AZ (US);

Inventors:

Mark David Lowenthal, Gilbert, AZ (US);

William Johnstone Ray, Fountain Hills, AZ (US);

Neil O. Shotton, Tempe, AZ (US);

Richard A. Blanchard, Los Altos Hills, CA (US);

Brad Oraw, Mesa, AZ (US);

Mark Allan Lewandowski, North Port, FL (US);

Jeffrey Baldridge, Chandler, AZ (US);

Eric Anthony Perozziello, Stanford, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/0203 (2014.01); H01L 25/04 (2014.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 23/00 (2006.01); H01L 51/00 (2006.01); H01L 33/56 (2010.01); H01L 51/44 (2006.01); H01L 31/0352 (2006.01); H01L 31/105 (2006.01); H01L 31/18 (2006.01); B82Y 20/00 (2011.01); H01L 25/075 (2006.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); B82Y 20/00 (2013.01); H01L 24/95 (2013.01); H01L 25/048 (2013.01); H01L 27/3281 (2013.01); H01L 31/035236 (2013.01); H01L 31/105 (2013.01); H01L 31/1852 (2013.01); H01L 31/1856 (2013.01); H01L 33/0079 (2013.01); H01L 33/56 (2013.01); H01L 51/0004 (2013.01); H01L 51/0007 (2013.01); H01L 51/448 (2013.01); H01L 51/52 (2013.01); H01L 51/5203 (2013.01); H01L 51/5237 (2013.01); H01L 51/56 (2013.01); H01L 25/0753 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13033 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); Y02E 10/544 (2013.01); Y02E 10/549 (2013.01);
Abstract

An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. In other exemplary embodiments a second solvent is also included, and the composition has a viscosity substantially between about 100 cps and about 25,000 cps at about 25° C. In an exemplary embodiment, a composition comprises: a plurality of diodes or other two-terminal integrated circuits; one or more solvents comprising about 15% to 99.9% of any of N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, N-octanol, ethanol, tetrahydrofurfuryl alcohol, cyclohexanol, and mixtures thereof; a viscosity modifier comprising about 0.10% to 2.5% methoxy propyl methylcellulose resin or hydroxy propyl methylcellulose resin or mixtures thereof; and about 0.01% to 2.5% of a plurality of substantially optically transparent and chemically inert particles having a range of sizes between about 10 to about 50 microns.


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