The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Feb. 27, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Carlo Marbella, Singapore, SG;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/14517 (2013.01); H01L 2224/16106 (2013.01); H01L 2224/1705 (2013.01); H01L 2224/81815 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A method of connecting a semiconductor package to a board includes providing a board having a plurality of contact regions, providing a semiconductor package having a plurality of contact areas, selecting a specific contact area out of the plurality of contact areas, applying solder balls to the contact areas and therein applying two or more specific solder balls to the specific contact area, and connecting the semiconductor package to the board in such a way that the two or more specific solder balls are connected with each other and with a contact region of the plurality of contact regions of the board.