The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Oct. 21, 2014
Applicant:

Sumida Corporation, Chuo-ku, Tokyo, JP;

Inventors:

Yasuo Shimanuki, Chiba, JP;

Masakazu Fukuoka, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/49861 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 23/49551 (2013.01); H01L 2224/10165 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16258 (2013.01); H01L 2224/26165 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/8114 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/12042 (2013.01);
Abstract

An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.


Find Patent Forward Citations

Shimanuki, Yasuo. (2016). Electronic component and method for manufacturing electronic component (U.S. Patent No. 9343334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9343334

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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