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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9343234 B1

PDFFull Text
Date of Patent:
May. 17, 2016

Filed:

Mar. 28, 2014

Monolithic ceramic electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Takehisa Sasabayashi, Nagaokakyo, JP;

Akihiro Motoki, Nagaokakyo, JP;

Makoto Ogawa, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Dion R Ferguson

Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01C 1/148 (2006.01); H01C 7/18 (2006.01); H01F 17/00 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01); H01L 41/047 (2006.01); H01F 27/29 (2006.01); H01C 7/00 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01C 1/148 (2013.01); H01C 7/18 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01L 41/0471 (2013.01); H01L 41/0472 (2013.01); H01C 7/008 (2013.01);
Abstract

A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating Eand an amount of extension of the second plating Esatisfy the relationship E/(E+E)≦20%, where Erepresents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and Erepresents a distance from the edge of the first plating layer to an edge of the second plating layer.

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