The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Apr. 23, 2014
Applicant:
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Inventors:
Sung Gap Im, Daejeon, KR;
Jae Bem You, Daejeon, KR;
Youngmin Yoo, Seoul, KR;
Myung Seok Oh, Incheon, KR;
Assignee:
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/50 (2006.01); D06M 23/16 (2006.01); C08J 7/00 (2006.01); D06M 10/02 (2006.01); D06M 10/10 (2006.01); D06M 11/38 (2006.01); D06B 1/02 (2006.01); D06M 15/277 (2006.01); D06M 23/06 (2006.01); B01D 67/00 (2006.01); B05D 1/00 (2006.01); D06M 101/32 (2006.01); D06M 101/34 (2006.01); B05D 5/04 (2006.01); B05D 5/08 (2006.01);
U.S. Cl.
CPC ...
D06M 23/16 (2013.01); B01D 67/0088 (2013.01); B01D 67/0093 (2013.01); C08J 7/00 (2013.01); D06B 1/02 (2013.01); D06M 10/025 (2013.01); D06M 10/10 (2013.01); D06M 11/38 (2013.01); D06M 15/277 (2013.01); D06M 23/06 (2013.01); B01D 2323/04 (2013.01); B05D 1/60 (2013.01); B05D 1/62 (2013.01); B05D 5/04 (2013.01); B05D 5/083 (2013.01); D06M 2101/32 (2013.01); D06M 2101/34 (2013.01); D06M 2200/11 (2013.01); D06M 2200/12 (2013.01);
Abstract
A method of preparing a material having a superhydrophobic region and a hydrophobic region is described, involving preparing a superhydrophobic surface body and hydrolyzing one surface of the prepared superhydrophobic surface body using a strong base. Such preparation method is simpler than conventional preparation methods and is capable of preparing a material having opposite surface characteristics at low costs.