The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Mar. 30, 2012
Applicants:

Alan Ritchie, Menlo Park, CA (US);

Donny Young, Cupertino, CA (US);

Wei W. Wang, Santa Clara, CA (US);

Ananthkrishna Jupudi, Milpitas, CA (US);

Thanh X. Nguyen, San Jose, CA (US);

Kirankumar Savandaiah, Bangalore, IN;

Inventors:

Alan Ritchie, Menlo Park, CA (US);

Donny Young, Cupertino, CA (US);

Wei W. Wang, Santa Clara, CA (US);

Ananthkrishna Jupudi, Milpitas, CA (US);

Thanh X. Nguyen, San Jose, CA (US);

Kirankumar Savandaiah, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/50 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/34 (2013.01); H01J 37/321 (2013.01); H01J 37/32091 (2013.01); H01J 37/32623 (2013.01); H01J 37/32651 (2013.01); H01J 37/32706 (2013.01); H01J 37/32715 (2013.01); H01J 37/3405 (2013.01); H01J 37/3411 (2013.01);
Abstract

Apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing a substrate includes a substrate support that may include a dielectric member having a surface to support a substrate thereon; one or more first conductive members disposed below the dielectric member and having a dielectric member facing surface adjacent to the dielectric member; and a second conductive member disposed about and contacting the one or more first conductive members such that RF energy provided to the substrate by an RF source returns to the RF source by traveling radially outward from the substrate support along the dielectric member facing surface of the one or more first conductive members and along a first surface of the second conductive member disposed substantially parallel to a peripheral edge surface of the one or more first conductive members after travelling along the dielectric layer facing surface.


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