The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Jan. 31, 2014
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Satoru Kunikata, Ibaraki, JP;

Takashi Kamijo, Ibaraki, JP;

Tomohiro Mori, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 3/16 (2006.01); G02B 1/10 (2015.01); C08J 7/04 (2006.01); G02B 5/30 (2006.01);
U.S. Cl.
CPC ...
C09K 3/16 (2013.01); C08J 7/04 (2013.01); G02B 1/10 (2013.01); G02B 5/305 (2013.01); C08J 2367/02 (2013.01); C08J 2475/04 (2013.01); Y10T 428/24355 (2015.01);
Abstract

A laminate according to an embodiment of the present invention includes: a resin substrate; a polyvinyl alcohol-based resin layer formed on one side of the resin substrate; and an antistatic layer formed on another side of the resin substrate and comprising a binder resin and a conductive material. The antistatic layer has a fine uneven surface; and the fine uneven surface includes protrusions having an average height of 25 nm or more and a softening temperature of 150° C. or more.


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