IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9340700 B1

PDFFull Text
Date of Patent:
May. 17, 2016

Filed:

Sep. 12, 2012

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Applicants:

Tomohito Iwashige, Osaka, JP;

Tomoaki Ichikawa, Osaka, JP;

Naoya Sugimoto, Osaka, JP;

Inventors:

Tomohito Iwashige, Osaka, JP;

Tomoaki Ichikawa, Osaka, JP;

Naoya Sugimoto, Osaka, JP;

Assignee:

NITTO DENKO CORPORATION, Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Robert Sellers

Int. Cl.
CPC ...
C08K 5/05 (2006.01); C08K 5/053 (2006.01); C08K 5/06 (2006.01); C08K 5/09 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); H01L 23/29 (2006.01); C09D 163/00 (2006.01); C08G 59/62 (2006.01); H01L 23/31 (2006.01); C08K 5/101 (2006.01); C08K 3/00 (2006.01); C08K 5/5425 (2006.01); C08L 23/26 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/621 (2013.01); C08K 5/05 (2013.01); C08K 5/06 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); C08K 3/0033 (2013.01); C08K 5/09 (2013.01); C08K 5/101 (2013.01); C08K 5/5425 (2013.01); C08L 23/26 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01);
Abstract

The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; (D) a compound represented by the following formula (1) in which Rrepresents a hydroxyl group or an alkoxy group, Rrepresents a hydrogen atom or a monovalent hydrocarbon group, and n is an integer of from 1 to 7; and (E) a release agent including at least one of the following (α) and (β): (α) a linear saturated carboxylic acid having a number average molecular weight of from 550 to 800, and (β) an oxidized polyethylene wax:RCH—CH—OR  (1).

Find Patent Forward Citations

Loading…