The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Nov. 01, 2013
Applicant:
National Tsing Hua University, Hsinchu, TW;
Inventors:
Heng-Chung Chang, Hsinchu, TW;
Wei-Leun Fang, Hsinchu, TW;
Assignee:
NATIONAL TSING HUA UNIVERSITY, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/113 (2006.01); B81B 3/00 (2006.01); H01L 41/12 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); H01L 41/125 (2013.01); B81B 2201/0264 (2013.01);
Abstract
A sensor chip has a supporting structure layer and a micro-inductor layer formed on the supporting structure layer and having an inductance. The micro-inductor layer comprises an insulating layer, at least one magnetic layer, and a micro-coil layer. When an external physical quantity is applied on sensor chip, the micro-inductor layer can deform correspondingly to generate a variation of the inductance. The variation of the inductance can be measured by an inductance measurement circuit. The inductance measurement circuit can be an external circuit or be integrated into the sensor chip.