The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Jun. 26, 2014
Applicant:

Dmg Mori Seiki Co., Ltd., Nara, JP;

Inventors:

Tomoyoshi Matsuyama, Iga, JP;

Masahide Kakutani, Nabari, JP;

Yuhei Kitade, Iga, JP;

Ryutaro Oshima, Iga, JP;

Takuya Kichibayashi, Iga, JP;

Assignee:

DMG MORI SEIKI CO., LTD., Yamatokoriyama-Shi, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 33/04 (2006.01); B65G 45/14 (2006.01); B65G 45/22 (2006.01); B23Q 11/00 (2006.01); B23Q 11/10 (2006.01); B01D 43/00 (2006.01);
U.S. Cl.
CPC ...
B23Q 11/0067 (2013.01); B23Q 11/0057 (2013.01); B23Q 11/1069 (2013.01); B01D 33/04 (2013.01); B01D 43/00 (2013.01); Y02P 70/171 (2015.11); Y10T 409/304088 (2015.01);
Abstract

To provide a chip disposal device of a machine tool which surely separates and collects a cutting fluid adhering to a chip lump, thereby capable of reducing an amount of the cutting fluid discharged to the outside of the machine. The chip disposal device includes a liquid separating partwhich separates and collects a cutting fluid adhering to chips, the liquid separating parthas a mounting partwhich is provided continuously from an inclined discharge surfaceand is inclined so as to get lower as it goes more apart outward from the inclined discharge surfaceand to which a first chip lump aconveyed by a first scraping plateis transferred. Then, the first chip lump aon the mounting partstays on the mounting partuntil dropping by being pushed by a second chip lump aconveyed by a second scraping platefollowing the first scraping plate


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