The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Apr. 08, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Joerg Ortner, Drobollach, AT;
Michael Sorger, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 19/00 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B22D 19/0072 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); H01L 21/02 (2013.01); H01L 21/311 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H05K 1/02 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/0502 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/06188 (2013.01); H01L 2224/94 (2013.01); H01L 2924/181 (2013.01); H05K 2201/09036 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/308 (2013.01); Y10S 977/887 (2013.01);
Abstract
In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, a stamp device may be disposed at least in the trench; at least one part of the trench that is free from the stamp device may be at least partially filled with trench filling material; and the stamp device may be removed from the trench.