The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Dec. 17, 2010
Applicants:

Dieter Weisshaupt, Immendingen, DE;

Anton Keller, Duerbheim, DE;

Christoph Rothweiler, Donaueschingen, DE;

Inventors:

Dieter Weisshaupt, Immendingen, DE;

Anton Keller, Duerbheim, DE;

Christoph Rothweiler, Donaueschingen, DE;

Assignee:

Aesculap AG, , DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 17/32 (2006.01); A61B 17/11 (2006.01); A61B 17/064 (2006.01); A61B 17/115 (2006.01); A61B 17/3205 (2006.01); A61B 18/14 (2006.01); A61B 18/00 (2006.01);
U.S. Cl.
CPC ...
A61B 17/1114 (2013.01); A61B 17/0643 (2013.01); A61B 17/115 (2013.01); A61B 18/1447 (2013.01); A61B 17/32053 (2013.01); A61B 18/1442 (2013.01); A61B 2017/111 (2013.01); A61B 2017/1132 (2013.01); A61B 2018/0063 (2013.01); A61B 2018/00601 (2013.01); A61B 2018/00619 (2013.01); A61B 2018/1412 (2013.01); A61B 2018/1455 (2013.01); A61B 2018/1467 (2013.01);
Abstract

The invention relates to improving a surgical system for bonding bodily tissue, comprising a surgical instrument having a bonding device for bonding bodily tissue, said bonding device comprising two tool elements displaceable relative to each other, wherein the instrument comprises a cutting device having a cutting element for cutting through tissue, and the cutting element is displaceably disposed relative to at least one of the tool elements, such that the cutting device is implemented in the form of an HF cutting device, wherein the cutting element comprises a cutting edge defining a cutting plane at an angle relative to a longitudinal axis defined by the instrument in the region of the bonding device.


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