The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Apr. 18, 2011
Applicants:
Akira Sasaki, Isesaki, JP;
Hisatsugu Tokunaga, Isesaki, JP;
Tetsuo Fujimura, Isesaki, JP;
Inventors:
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/34 (2006.01); B32B 27/08 (2006.01); B32B 7/06 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B65D 43/02 (2006.01); H05K 5/03 (2006.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); C09J 7/02 (2006.01); B65D 75/32 (2006.01); B65D 75/42 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/205 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); C09J 7/0296 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/202 (2013.01); B32B 2307/31 (2013.01); B32B 2307/518 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01); B65D 75/325 (2013.01); B65D 75/42 (2013.01); B65D 2585/86 (2013.01); C08K 3/04 (2013.01); C09J 2201/602 (2013.01); C09J 2201/61 (2013.01); C09J 2205/102 (2013.01); C09J 2205/106 (2013.01); C09J 2205/114 (2013.01); C09J 2425/00 (2013.01); C09J 2433/00 (2013.01); Y10T 428/1405 (2015.01); Y10T 428/1462 (2015.01);
Abstract
Disclosed is a cover film, which includes at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that can be heat-sealed to a carrier tape, and wherein the heat seal layer contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.