The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Dec. 18, 2013
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, Aichi, JP;

Inventors:

Yuma Otsuka, Komaki, JP;

Kazunori Fukunaga, Inuyama, JP;

Atsushi Uchida, Kakamigahara, JP;

Kouhei Yoshimura, Nagoya, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01); H05K 3/38 (2006.01); H05K 3/10 (2006.01); H05K 3/14 (2006.01); H05K 3/16 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 3/388 (2013.01); H05K 1/0306 (2013.01); H05K 3/108 (2013.01); H05K 3/146 (2013.01); H05K 3/16 (2013.01); H05K 3/244 (2013.01); H05K 3/403 (2013.01); H05K 3/4617 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1338 (2013.01); H05K 2203/1394 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.


Find Patent Forward Citations

Otsuka, Yuma. (2016). Ceramic substrate, and method of manufacturing the same (U.S. Patent No. 9338897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9338897

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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