The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Dec. 02, 2011
Applicants:
Jeroen Van Den Brand, Delft, NL;
Roel Henry Louis Kusters, Delft, NL;
Andreas Heinrich Dietzel, Delft, NL;
Inventors:
Jeroen Van Den Brand, Delft, NL;
Roel Henry Louis Kusters, Delft, NL;
Andreas Heinrich Dietzel, Delft, NL;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H01L 23/4985 (2013.01); H01L 24/24 (2013.01); H01L 24/76 (2013.01); H01L 24/82 (2013.01); H05K 1/0283 (2013.01); H05K 1/189 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/766 (2013.01); H01L 2224/767 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/76261 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82104 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/82874 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H05K 3/12 (2013.01); H05K 3/305 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/1545 (2013.01); H05K 2203/175 (2013.01); Y10T 29/49133 (2015.01); Y10T 29/53178 (2015.01);
Abstract
A method is presented for assembling a component () with a flexible substrate (), the component having electric contacts (). The method comprises the steps of Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.