The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
May. 28, 2015
Oki Data Corporation, Tokyo, JP;
Takahito Suzuki, Tokyo, JP;
Eisuke Kuroki, Tokyo, JP;
Oki Data Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a printed wiring board; plural semiconductor array elements mounted on the printed wiring board in a row with an adhesive, each of the semiconductor array elements including plural semiconductor elements arranged in a row, the semiconductor array elements including a first semiconductor array element and a second semiconductor array element adjacent to the first semiconductor array element, the first semiconductor array element having a first facing surface, the second semiconductor array element having a second facing surface facing the first facing surface; a first contact prevention member that is made of organic material and disposed to project from the first facing surface; and a second contact prevention member that is made of organic material and disposed to project from the second facing surface. The first and second contact prevention members are disposed to abut each other or face each other with a gap therebetween.