The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Mar. 27, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masayuki Kikushima, Ina, JP;

Masako Tanaka, Okaya, JP;

Naohisa Obata, Minowa, JP;

Yukihiro Unno, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H03H 9/05 (2006.01); H03H 9/17 (2006.01); H01L 41/053 (2006.01); H01L 41/09 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H03H 9/172 (2013.01); H01L 41/0913 (2013.01); H03H 9/0538 (2013.01); H03B 5/32 (2013.01); H03H 9/0547 (2013.01); H03H 9/1021 (2013.01);
Abstract

A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge thereof, and a third thick section provided along a third outer edge thereof. When a maximum size of the second thick section in the vibration direction is Lmax and a minimum size thereof is Lmin, an average size expressed by (Lmax+Lmin)/2 is 100 μm or smaller.


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