The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Mar. 13, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jong-Chul Park, Seongnam-si, KR;

Jae-Hun Seo, Suwon-si, KR;

Byong-Jae Bae, Hwaseong-si, KR;

Chang-Woo Sun, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/228 (2013.01);
Abstract

A method of manufacturing magnetoresistive random access memory (MRAM) device includes forming first and second patterns on a substrate in an alternating and repeating arrangement, forming a first capping layer on top surfaces of the first and second patterns, and removing first portions of the first capping layer and a portion of the second patterns thereunder to form first openings exposing the substrate. The method further includes forming source lines filling lower portions of the first openings, respectively, forming second capping layer patterns filling upper portions of the first openings, respectively, and removing second portions of the first capping layer and a portion of the second patterns thereunder to form second openings exposing the substrate. Then, contact plugs and pad layers are integrally formed and sequentially stacked on the substrate to fill the second openings.


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