The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jun. 25, 2015
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventors:

Koichi Arai, Kanagawa, JP;

Masaki Hama, Kanagawa, JP;

Yasuaki Kagotoshi, Kanagawa, JP;

Kenichi Hisada, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7802 (2013.01); H01L 21/02236 (2013.01); H01L 21/02378 (2013.01); H01L 21/02529 (2013.01); H01L 21/049 (2013.01); H01L 29/1608 (2013.01); H01L 29/42356 (2013.01); H01L 29/66068 (2013.01); H01L 29/66681 (2013.01); H01L 29/66712 (2013.01); H01L 29/7801 (2013.01);
Abstract

The present invention makes it possible to improve the accuracy of wet etching and miniaturize a semiconductor device in the case of specifying an active region of a vertical type power MOSFET formed over an SiC substrate by opening an insulating film over the substrate by the wet etching. After a silicon oxide film having a small film thickness and a polysilicon film having a film thickness larger than the silicon oxide film are formed in sequence over an epitaxial layer, the polysilicon film is opened by a dry etching method, successively the silicon oxide film is opened by a wet etching method, and thereby the upper surface of the epitaxial layer in an active region is exposed.


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