The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Mar. 26, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Friedrich Kroener, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/763 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 23/00 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66712 (2013.01); H01L 29/0657 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 29/7809 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 29/0873 (2013.01); H01L 29/0878 (2013.01); H01L 29/0886 (2013.01); H01L 29/41741 (2013.01); H01L 29/456 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32238 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
An electronic component includes a semiconductor substrate defined by a generally planar first face, a generally planar second face and side faces extending between the generally planar second face and the generally planar first face. The semiconductor substrate has a curved contour between the generally planar second face and the side faces.