The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

May. 15, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Christos D. Dimitrakopoulos, Baldwin Place, NY (US);

Keith E. Fogel, Hopewell Junction, NY (US);

Jeehwan Kim, White Plains, NY (US);

Hongsik Park, Yorktown Heights, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/027 (2006.01); H01L 21/20 (2006.01); B32B 37/14 (2006.01); C01B 31/00 (2006.01); B32B 38/10 (2006.01); B32B 9/04 (2006.01); H01L 29/16 (2006.01); B32B 37/26 (2006.01); C01B 31/04 (2006.01); B32B 9/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1606 (2013.01); B32B 9/007 (2013.01); B32B 9/04 (2013.01); B32B 9/041 (2013.01); B32B 37/26 (2013.01); B32B 38/10 (2013.01); C01B 31/00 (2013.01); C01B 31/0461 (2013.01); H01L 21/0272 (2013.01); H01L 21/2007 (2013.01); H01L 23/53276 (2013.01); B32B 2307/202 (2013.01); B32B 2307/704 (2013.01); Y10T 156/11 (2015.01); Y10T 156/1153 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/26 (2015.01);
Abstract

A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a first substrate. The spreading layer has at least one monolayer. A stressor layer is formed on the spreading layer. The stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein at least the closest monolayer remains on the stressor layer. The at least one monolayer is stamped against a second substrate to adhere remnants of the two-dimensional material on the at least one monolayer to the second substrate to provide a single monolayer on the stressor layer. The single monolayer is transferred to a third substrate.


Find Patent Forward Citations

Loading…