The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Sep. 05, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Kohei Hasegawa, Yokohama, JP;

Takashi Yamamoto, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 23/64 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/64 (2013.01); H01L 25/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/30107 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes first to fourth circuit substrates. Each of the first to fourth circuit substrates includes a switching device. The first circuit substrate includes a first terminal unit and a second terminal unit set to a potential lower than a potential of the first terminal unit. The third circuit substrate includes a fifth terminal unit and a sixth terminal unit set to a potential lower than a potential of the fifth terminal unit. The first circuit substrate overlaps the third circuit substrate. The second circuit substrate overlaps the fourth circuit substrate. A direction from the first terminal unit toward the second terminal unit is reversely oriented with respect to a direction from the fifth terminal unit toward the sixth terminal unit.


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