The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Aug. 14, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kenneth J. Goodnow, Essex Junction, VT (US);

Todd E. Leonard, Williston, VT (US);

Stephen G. Shuma, Underhill, VT (US);

Peter A. Twombly, Shelburne, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/00 (2006.01); H01H 59/00 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); B81B 3/00 (2006.01); H01L 25/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); B81B 3/0056 (2013.01); B81B 3/0086 (2013.01); B81C 1/00158 (2013.01); B81C 1/00198 (2013.01); H01H 59/0009 (2013.01); H01L 23/528 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/50 (2013.01); B81C 1/00182 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.


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