The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Jun. 29, 2012
Applicants:
Damien Veychard, Meylan, FR;
Fabien Quercia, Saint Marcelin, FR;
Eric Perriaud, Pont de Claix, FR;
Inventors:
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 24/45 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/48507 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/85048 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/14 (2013.01); H01L 2924/20105 (2013.01);
Abstract
One embodiment is directed to a welding pad capable of receiving a ball-shaped copper wire at its end, including a first copper pad coated with a protection layer and topped with a second pad containing aluminum having dimensions smaller than those of the first pad and smaller than the ball diameter once said ball has been welded to the welding pad.