The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jan. 30, 2015
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Wei Yi, San Diego, CA (US);

Yi Lou, San Diego, CA (US);

Paul Penzes, San Diego, CA (US);

Pranjal Srivastava, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/481 (2013.01); H01L 24/82 (2013.01); H01L 27/0688 (2013.01);
Abstract

A particular three-dimensional integrated circuit stack includes a first die including a first bonding interface and a first plurality of interconnect layers arranged according to a first Manhattan wiring scheme. The three-dimensional integrated circuit stack also includes a second die including a second bonding interface and a second plurality of interconnect layers arranged according to a second Manhattan wiring scheme. The first die and the second die stacked with the first bonding interface coupled to the second bonding interface such that the first Manhattan wiring scheme and the second Manhattan wiring scheme are non-Manhattan with respect to each other.


Find Patent Forward Citations

Yi, Wei. (2016). Three-dimensional integrated circuit stack (U.S. Patent No. 9337146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9337146

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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