The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Oct. 06, 2015
Applicants:

International Business Machines Corporation, Armonk, NY (US);

Globalfoundries Inc., Grand Cayman, KY;

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

O Sung Kwon, Wappingers Falls, NY (US);

Dan Moy, Bethel, CT (US);

Kihwang Son, Schenectady, NY (US);

Xiaoqiang Zhang, Rexford, NY (US);

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 23/532 (2006.01); H01L 21/321 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 21/321 (2013.01); H01L 22/34 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01); G01R 31/2858 (2013.01); H01L 22/12 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure generally provides for an e-fuse structure and corresponding method for fusing the same and monitoring material leakage. The e-fuse structure can include a metal dummy structure and an electrical fuse link substantially aligned with a portion of the metal dummy structure, wherein the metal dummy structure cools at least part of the electrical fuse link in response to an electric current passing through the electrical fuse link.


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