The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Sep. 01, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Shailesh Kumar, Noida, IN;

Rishi Bhooshan, Ghaziabad, IN;

Meng Kong Lye, Shah Alam, MY;

Sumit Varshney, Noida, IN;

Chetan Verma, Noida, IN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5225 (2013.01); H01L 23/4952 (2013.01); H01L 24/85 (2013.01); H01L 2924/30105 (2013.01);
Abstract

A semiconductor device includes a semiconductor die having opposing first and second main surfaces, contact pads and a metal ring accessible from the first main surface, and signal leads surrounding and spaced from the die. Each of the signal leads has a first end near the die, a second end remote from the die, and a body extending between the first and second ends. A dummy lead frame is disposed between the signal leads first ends and the die, and connected to a fixed potential. First bond wires are coupled to respective ones of the signal leads and the contact pads. Second, shield bond wires, located adjacent to respective ones of the bond wires, are coupled to the dummy lead frame and the metal ring.


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