The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jul. 21, 2015
Applicant:

Alpha and Omega Semiconductor (Cayman) Ltd., Sunnyvale, CA (US);

Inventor:

Yan Huo, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 21/78 (2013.01); H01L 23/053 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49811 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/0901 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A small and ultra-thin power semiconductor device and a preparation method are disclosed. The device includes a chip mounting unit with a plurality of pads with a plate arranged on top surface of each pad; a semiconductor chip flipped and attached on the chip mounting unit, where the electrodes at the front of the chip are electrically connected to the pads; a plastic packaging body covering the chip mounting units and the chip, where the top surface of the plate and the back surface of the chip are exposed out from top surface of the plastic packaging body and the bottom surfaces of the pads are exposed out of the bottom surface of the plastic packaging body; a plurality of top metal segments arranged on the top surface of the plastic packaging body and electrically connected to the top surface of each plate and the back surface of the chip.


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