The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

May. 09, 2012
Applicants:

Shambhu N. Roy, Sunnyvale, CA (US);

Vincent E. Burkhart, Cupertino, CA (US);

Scott J. Fields, Hollister, CA (US);

Inventors:

Shambhu N. Roy, Sunnyvale, CA (US);

Vincent E. Burkhart, Cupertino, CA (US);

Scott J. Fields, Hollister, CA (US);

Assignee:

Novellus Systems, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/68785 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A wafer support assembly including a wafer support and cooling plate with radial thermal chokes is provided. The cooling plate and wafer support may have limited contact and may not contact each other outside of certain limited thermal contact patches. The thermal contact patches may generally define one or more radial thermal choke regions. In some implementations, high- and low-temperature cooling systems may be placed at one or more locations across the cooling plate to assist in temperature management.


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