The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Feb. 12, 2015
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventor:

Shinya Iijima, Hadano, JP;

Assignee:

FUJITSI LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01P 5/107 (2006.01);
U.S. Cl.
CPC ...
H01L 21/52 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 21/568 (2013.01); H01L 23/295 (2013.01); H01L 24/96 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/142 (2013.01); H01L 2924/1815 (2013.01); H01P 5/107 (2013.01);
Abstract

A high frequency module includes: a semiconductor chip provided over a first surface side of a resin layer; a first waveguide provided over the first surface side of the resin layer and sealed together with the semiconductor chip by a resin; a wire provided over a second surface side of the resin layer and electrically coupled to the semiconductor chip and extending to a position of the first waveguide; a second waveguide bonded to the first waveguide; and a metal plate provided over the first surface side of the resin layer at a position opposite to the first waveguide and electrically coupled to the wire, wherein a part of the wire extending to the position of the first waveguide serves as an antenna coupler.


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