The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Nov. 18, 2014
Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;
Mitsuru Tanikawa, Osaka, JP;
Takashi Watanabe, Osaka, JP;
Michihisa Ueda, Osaka, JP;
Shigeru Nakamura, Shiga, JP;
Hiroshi Maenaka, Osaka, JP;
Ryosuke Takahashi, Osaka, JP;
Takanori Inoue, Osaka, JP;
Yoshito Fujita, Osaka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy. The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.