The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Mar. 29, 2013
Applicant:
Hitachi Kokusai Electric Inc., Tokyo, JP;
Inventors:
Assignee:
HITACHI KOKUSAI ELECTRIC INC., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); C23C 16/26 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02115 (2013.01); C23C 16/26 (2013.01); C23C 16/4412 (2013.01); C23C 16/45523 (2013.01); H01L 21/0228 (2013.01);
Abstract
Disclosed is a method of manufacturing a semiconductor device. The method includes forming a film containing carbon on a substrate by repeating a cycle plural times. The cycle includes: in a state in which a substrate housed in a processing chamber is heated, supplying an organic-based gas into the processing chamber and confining the organic-based gas inside the processing chamber; maintaining a state in which the organic-based gas is confined inside the processing chamber; and exhausting an inside of the processing chamber.