The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Aug. 01, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Wi Heon Kim, Gyunggi-do, KR;

Dae Bok Oh, Gyunggi-do, KR;

Jea Hoon Lee, Gyunggi-do, KR;

Sang Huk Kim, Gyunggi-do, KR;

Jae Yeol Choi, Gyunggi-Do, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/01 (2006.01); H01G 4/06 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H01G 2/06 (2006.01); H01G 4/005 (2006.01); H01G 4/12 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/01 (2013.01); H01G 2/06 (2013.01); H01G 4/005 (2013.01); H01G 4/06 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10454 (2013.01);
Abstract

There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03≦Tb/T≦0.25 is satisfied.


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