The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jan. 31, 2012
Applicants:

Moray Mclaren, Bristol, GB;

Paul Kessler Rosenberg, Sunnyvale, CA (US);

Michael Renne Ty Tan, Menlo Park, CA (US);

Terrel Morris, Garland, TX (US);

Inventors:

Moray McLaren, Bristol, GB;

Paul Kessler Rosenberg, Sunnyvale, CA (US);

Michael Renne Ty Tan, Menlo Park, CA (US);

Terrel Morris, Garland, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/25 (2013.01); G02B 6/43 (2006.01); G02B 6/42 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/4206 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4257 (2013.01); H01L 25/16 (2013.01); H04B 10/2504 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15192 (2013.01);
Abstract

A hybrid electro-optical package for an opto-electronic engine. The package includes a carrier substrate, and a package base. Electrical vias and an optical via of the carrier substrate communicate between a back side and a front side of the carrier substrate. The package base is coupled to the carrier substrate by intra-package electrical interconnects. The carrier substrate is to interconnect electrically with an opto-electronic component mounted on its back side, and includes an optical aperture at its front side for communication of optical signals. Similarly, lands disposed at a front side of the package base provide for communication of electrical signals to an integrated circuit and the opto-electronic component. A system and an opto-electronic engine that include the hybrid electro-optical package are also provided.


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