The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jun. 23, 2014
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Young-Tak Han, Daejeon, KR;

Sang Ho Park, Daejeon, KR;

Dong-Hun Lee, Daejeon, KR;

Jang Uk Shin, Daejeon, KR;

Sang-Pil Han, Daejeon, KR;

Yongsoon Baek, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/136 (2006.01); G02B 6/42 (2006.01); G02B 6/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/136 (2013.01); G02B 6/423 (2013.01); G02B 6/4231 (2013.01); H01L 24/11 (2013.01); G02B 2006/12176 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01);
Abstract

Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.


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