The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Apr. 22, 2010
Ching-pang Lee, Cincinnati, OH (US);
Chander Prakash, Oviedo, FL (US);
Gary B. Merrill, Orlando, FL (US);
Andreas Heselhaus, Duesseldorf, DE;
Andrew J. Burns, Longwood, FL (US);
Ching-Pang Lee, Cincinnati, OH (US);
Chander Prakash, Oviedo, FL (US);
Gary B. Merrill, Orlando, FL (US);
Andreas Heselhaus, Duesseldorf, DE;
Andrew J. Burns, Longwood, FL (US);
Siemens Energy, Inc., Orlando, FL (US);
Mikro Systems, Inc., Charlottesville, VA (US);
Abstract
A wall structure () with layers (A, B, C, D, E) of non-random voids (A,B,B,B) that interconnect to form discretely defined tortuous passages between an interior () and an exterior surface () of the wall for transpiration cooling of the wall. A coolant flow () through the wall may be metered by restrictions in coolant outlets () and/or within the passages to minimize the coolant requirement. Pockets () may be formed on the exterior surface of the wall for thermal Insulation (). The layers may be formed by lamination, additive manufacturing, or casting. Layer geometries include alternating layers (A, B, C) with different overlapping void patterns (), 3-D lattice structures (), and offset waffle structures ().