The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jan. 20, 2015
Applicant:

General Engineering & Research, L.l.c., San Diego, CA (US);

Inventor:

Robin Ihnfeldt, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01); B24B 1/00 (2006.01); C09K 3/14 (2006.01); C09K 13/00 (2006.01); C09K 13/06 (2006.01); C08K 9/10 (2006.01); C09G 1/00 (2006.01); C09G 1/04 (2006.01); C08K 9/00 (2006.01); C09C 1/02 (2006.01); H01L 21/768 (2006.01); B01J 13/14 (2006.01); C09C 1/30 (2006.01); C23F 3/00 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B01J 13/14 (2013.01); B24B 1/00 (2013.01); C08K 9/00 (2013.01); C08K 9/10 (2013.01); C09C 1/02 (2013.01); C09C 1/3063 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09K 3/1436 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/00 (2013.01); C09K 13/06 (2013.01); C23F 3/00 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C01P 2006/14 (2013.01); C01P 2006/16 (2013.01);
Abstract

The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.


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