The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jun. 25, 2013
Applicant:

Mizushima Ferroalloy Co., Ltd., Kurashiki-shi, Okayama, JP;

Inventors:

Takahisa Koshida, Kurashiki, JP;

Syunji Kasahara, Satosho-cho, JP;

Shoichi Hiwasa, Kurashiki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/38 (2006.01); C08K 7/18 (2006.01); C04B 35/626 (2006.01); C04B 35/628 (2006.01); C01B 21/064 (2006.01); C08K 7/04 (2006.01);
U.S. Cl.
CPC ...
C08K 7/18 (2013.01); C01B 21/0648 (2013.01); C04B 35/626 (2013.01); C04B 35/628 (2013.01); C08K 3/38 (2013.01); C01P 2004/03 (2013.01); C01P 2004/30 (2013.01); C01P 2004/32 (2013.01); C01P 2004/61 (2013.01); C01P 2006/12 (2013.01); C01P 2006/21 (2013.01); C01P 2006/32 (2013.01); C01P 2006/80 (2013.01); C08K 7/04 (2013.01); C08K 2003/385 (2013.01); Y10T 428/2982 (2015.01);
Abstract

Sintered spherical BN particles having secondary particles formed of aggregated primary BN particles, in which the number ratio of particles, each having a recess on its surface is 50% or more in the sintered spherical BN particles, and each of the sintered spherical BN particles has a compressive strength of 0.1 MPa to 100 MPa. The sintered spherical BN particles are not only excellent in heat dissipation properties and adhesiveness, but also have high compressive strength, and therefore, show a small variation in heat dissipation properties and is free from conduction failure, which would otherwise be caused by exfoliation of the copper foil, when used as a filling material for a polymer composite material.


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