The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Sep. 29, 2011
Applicants:
Jun Mitadera, Kanagawa, JP;
Masashi Kurokawa, Kanagawa, JP;
Takahiro Takano, Kanagawa, JP;
Inventors:
Assignee:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/08 (2006.01); C08G 69/26 (2006.01); C08G 69/06 (2006.01); C08L 77/10 (2006.01); C08G 18/60 (2006.01); C08L 77/06 (2006.01); C08K 5/29 (2006.01);
U.S. Cl.
CPC ...
C08G 69/26 (2013.01); C08G 18/603 (2013.01); C08G 69/06 (2013.01); C08G 69/265 (2013.01); C08K 5/29 (2013.01); C08L 77/06 (2013.01); C08L 77/10 (2013.01); C08J 2377/06 (2013.01);
Abstract
Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.