The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Oct. 19, 2010
Joerg Blaschke, Remscheid, DE;
Kirsten Luetzeler, Muenster, DE;
Walter Zink, Muenster, DE;
Ricardo Luiz Willemann, Shanghai, CN;
Kathrin Salwiczek, Marl, DE;
Georg Schaefer, Datteln, DE;
Joerg Blaschke, Remscheid, DE;
Kirsten Luetzeler, Muenster, DE;
Walter Zink, Muenster, DE;
Ricardo Luiz Willemann, Shanghai, CN;
Kathrin Salwiczek, Marl, DE;
Georg Schaefer, Datteln, DE;
Evonik Degussa GmbH, Essen, DE;
Abstract
The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 μm, which is suitable for producing dimensionally stable circuit boards.