The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Oct. 05, 2010
Applicants:

Christian Schoen, Dresden, DE;

Thorsten Joedicke, Toenisvorst, DE;

Dirk Kurowski, Gevelsberg, DE;

Inventors:

Christian Schoen, Dresden, DE;

Thorsten Joedicke, Toenisvorst, DE;

Dirk Kurowski, Gevelsberg, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01L 99/00 (2010.01); B29C 65/60 (2006.01); B01L 3/00 (2006.01); B29C 65/00 (2006.01); B81C 3/00 (2006.01); B29C 65/08 (2006.01); B29C 65/82 (2006.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 33/00 (2006.01); B29K 69/00 (2006.01); B29K 71/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/606 (2013.01); B01L 3/502707 (2013.01); B29C 66/542 (2013.01); B29C 66/5412 (2013.01); B29C 66/81422 (2013.01); B29C 66/8322 (2013.01); B29C 66/91411 (2013.01); B29C 66/91921 (2013.01); B29C 66/91943 (2013.01); B29C 66/929 (2013.01); B29C 66/949 (2013.01); B81C 3/001 (2013.01); B01L 2200/025 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B29C 65/08 (2013.01); B29C 65/8207 (2013.01); B29C 65/8215 (2013.01); B29C 66/81417 (2013.01); B29C 66/919 (2013.01); B29C 66/91421 (2013.01); B29C 66/91933 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2025/00 (2013.01); B29K 2033/12 (2013.01); B29K 2069/00 (2013.01); B29K 2071/00 (2013.01); B29L 2031/756 (2013.01); B81B 2201/058 (2013.01); B81C 2203/032 (2013.01); B81C 2203/051 (2013.01);
Abstract

A cartridge includes a fluidically conductive floor element, a cover, and a film disposed between the elements. The cover or the floor element and the film include a filling opening for filling microfluidic channels in one of the elements having sample fluid. Pins engage in corresponding holes in the film and the associated element. By way of deforming a pin, a friction fit is produced with the wall of a hole, and a head contacting the associated substrate in a form-fitting manner is formed. A press tool is placed on a head end of a pin at a predetermined pressure, and heat transfer into the pin takes place during a weld time. The pin material is brought to above the glass transition temperature and/or the melting point, and a friction fit between the pin and the wall of the hole is formed by flowing the pin material in the hole.


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