The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Dec. 12, 2012
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Korea Autoglass Corporation, Yeongi, Chungcheongnam-Do, KR;
Heesung Material Ltd., Yongin, Gyeonggi-Do, KR;
Hae Won Jeong, Gyeonggi-do, KR;
Hyun Dal Park, Gyeonggi-do, KR;
Tae Seung Lee, Gyeonggi-do, KR;
Seung Kyu Kim, Gyeonggi-do, KR;
Hong Nho Joo, Chungcheongnam-do, KR;
Ho June Yoon, Chungcheongnam-do, KR;
Min Ho Bak, Ulsan, KR;
Joo Dong Lee, Gyeonggi-do, KR;
Hyun Chae Jung, Gyeonggi-do, KR;
Sun Myung Lee, Gyeonggi-do, KR;
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Korea Autoglass Corporation, Yeongi, Chungcheongnam-do, KR;
Heesung Material Ltd., Yongin, Gyeonggi-do, KR;
Abstract
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.