The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Aug. 27, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;

Inventors:

Kosuke Nakano, Nagaokakyo, JP;

Hidekiyo Takaoka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/19 (2006.01); B23K 1/00 (2006.01); B23K 31/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/22 (2006.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); H05K 3/34 (2006.01); B23K 35/02 (2006.01); H01G 4/228 (2006.01); B23K 1/20 (2006.01);
U.S. Cl.
CPC ...
B23K 31/02 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 35/025 (2013.01); B23K 35/22 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/3026 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01G 4/228 (2013.01); H05K 3/3442 (2013.01); H05K 3/3463 (2013.01); B23K 2201/00 (2013.01); B23K 2201/42 (2013.01); B23K 2203/08 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11); Y10T 403/479 (2015.01);
Abstract

A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.


Find Patent Forward Citations

Loading…