The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Feb. 28, 2013
U.s. Army Research Laboratory Attn: Rdrl-loc-i, Adelphi, MD (US);
Kristopher A. Darling, Havre de Grace, MD (US);
Laszlo J. Kecskes, Havre de Grace, MD (US);
Brady G. Butler, Havre de Grace, MD (US);
The United States of America as represented by the Secretary of the Army, Washington, DC (US);
Abstract
A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.