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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9333525 B1

PDFFull Text
Date of Patent:
May. 10, 2016

Filed:

Jan. 21, 2014

Substrate spreading device for vacuum processing apparatus, vacuum processing apparatus with substrate spreading device and method for operating same

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Florian Ries, Westerngrund, DE;

Andreas Sauer, Groβostheim, DE;

Stefan Hein, Blackenbach, DE;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:

Patterson & Sheridan, LLP

Primary Examiner:

Binu Thomas

Int. Cl.
CPC ...
C23C 14/56 (2006.01); C23C 16/46 (2006.01); C23C 16/54 (2006.01); B05C 9/14 (2006.01); B05C 13/00 (2006.01); B05C 9/08 (2006.01); B05C 1/08 (2006.01); B05C 1/12 (2006.01); B05C 15/00 (2006.01); B05D 3/12 (2006.01); C23C 16/02 (2006.01); C23C 14/50 (2006.01); C23C 16/458 (2006.01); C23C 16/48 (2006.01); H01J 37/32 (2006.01); B65G 23/34 (2006.01); G11B 5/85 (2006.01);
U.S. Cl.
CPC ...
B05C 9/08 (2013.01); B05C 1/0826 (2013.01); B05C 1/12 (2013.01); B05C 9/14 (2013.01); B05C 13/00 (2013.01); B05C 15/00 (2013.01); B05D 3/12 (2013.01); C23C 14/50 (2013.01); C23C 14/562 (2013.01); C23C 16/0209 (2013.01); C23C 16/458 (2013.01); C23C 16/46 (2013.01); C23C 16/481 (2013.01); C23C 16/545 (2013.01); H01J 37/3277 (2013.01); B65G 23/34 (2013.01); G11B 5/85 (2013.01);
Abstract

A processing apparatus for processing a flexible substrate, particularly a vacuum processing apparatus for processing a flexible substrate, is described. The processing apparatus includes a vacuum chamber; a processing drum within the vacuum chamber, wherein the processing drum is configured to rotate around an axis extending in a first direction; and a heating device adjacent to the processing drum, wherein the heating device is configured for spreading the substrate in the first direction or for maintaining a spread of the substrate in the first direction, and wherein the heating device has a dimension in a direction parallel to a substrate transport direction of at least 20 mm.

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