The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jul. 22, 2013
Applicant:

Mycartis NV, Zwijnaarde/Ghent, BE;

Inventors:

Nicolas Demierre, Chatel-St-Denis, CH;

Stephan Gamper, Lausanne, CH;

Raphael Tornay, Illarsaz, CH;

Philippe Renaud, Lausanne, CH;

Assignee:

MYCARTIS NV, Zwijnaarde/Ghent, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G01N 15/14 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/502761 (2013.01); B01L 3/545 (2013.01); G01N 15/1456 (2013.01); B01L 2200/0647 (2013.01); B01L 2200/10 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0803 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/0893 (2013.01); B01L 2300/16 (2013.01);
Abstract

The present invention relates to a method for producing microcarriers, the method comprising the steps of providing a wafer having a bottom layer, a top layer and an insulating layer, structuring the top layer to define at least one three-dimensional structure on the top surface of the top layer, etching away the top layer to delineate lateral walls of bodies of the microcarriers, applying a continuous polymer layer over the top surface of the bodies of the microcarriers, removing the bottom layer and the insulating layer, structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers.


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