The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Mar. 17, 2015
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Mitsuharu Ono, Nagoya, JP;

Fumiharu Sato, Nagoya, JP;

Shuji Ueda, Nagoya, JP;

Hiroyuki Suenobu, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 21/00 (2006.01); B01J 21/04 (2006.01); B01J 23/02 (2006.01); B01D 3/10 (2006.01); B01D 50/00 (2006.01); B01D 53/34 (2006.01); B32B 3/12 (2006.01); G03B 21/62 (2014.01); D06N 7/04 (2006.01); B01J 21/16 (2006.01); C04B 35/14 (2006.01); C04B 38/00 (2006.01); C04B 38/06 (2006.01); B01D 46/24 (2006.01); B01D 53/94 (2006.01); B01J 21/12 (2006.01); B01J 23/30 (2006.01); B01J 35/00 (2006.01); B01J 35/04 (2006.01); F01N 3/022 (2006.01); C04B 35/626 (2006.01); C04B 35/63 (2006.01);
U.S. Cl.
CPC ...
B01J 21/16 (2013.01); B01D 46/2418 (2013.01); B01D 53/945 (2013.01); B01J 21/12 (2013.01); B01J 23/30 (2013.01); B01J 35/0006 (2013.01); B01J 35/04 (2013.01); C04B 35/14 (2013.01); C04B 35/62665 (2013.01); C04B 35/6316 (2013.01); C04B 38/0006 (2013.01); C04B 38/0074 (2013.01); C04B 38/0096 (2013.01); C04B 38/067 (2013.01); F01N 3/0222 (2013.01); B01D 2255/2092 (2013.01); B01D 2255/20707 (2013.01); B01D 2255/20723 (2013.01); B01D 2255/20776 (2013.01); B01D 2255/30 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/349 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/36 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/9607 (2013.01); Y10T 428/24149 (2015.01);
Abstract

There is disclosed a honeycomb structure. A honeycomb structure includes a pillar-shaped honeycomb structure body having partition walls defining a plurality of cells which become through channels for a fluid and extend from a first end face to a second end face, the partition walls are constituted of a porous body having aggregates and a bonding material to bond the aggregates to one another in a state where pores are formed among the aggregates, the aggregates include molten silica particles, the bonding material includes glass, a content ratio of SiOin the porous body is 70 mass % or more, and a thermal expansion coefficient of the porous body at 40 to 800° C. is from 1.5 to 6.0×10/° C.


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