The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Sep. 09, 2014
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Shingo Yoshioka, Osaka, JP;
Hiroaki Fujiwara, Nara, JP;
Hiromitsu Takashita, Osaka, JP;
Tsuyoshi Takeda, Osaka, JP;
Assignee:
PANASONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H05K 1/111 (2013.01); H05K 3/0076 (2013.01); H05K 3/0079 (2013.01); H05K 3/107 (2013.01); H05K 3/185 (2013.01); H05K 3/4007 (2013.01); H05K 1/0284 (2013.01); H05K 1/0373 (2013.01); H05K 3/0014 (2013.01); H05K 3/0032 (2013.01); H05K 3/0044 (2013.01); H05K 3/0085 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0224 (2013.01); H05K 2201/0233 (2013.01); H05K 2201/0239 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/09972 (2013.01); H05K 2203/013 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/0565 (2013.01); H05K 2203/0706 (2013.01); H05K 2203/0776 (2013.01); H05K 2203/1163 (2013.01); Y02P 70/611 (2015.11);
Abstract
One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.